Wafer level fan-out with electromagnetic shielding

ABSTRACT

The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

RELATED APPLICATIONS

This application claims the benefit of U.S. provisional patentapplication No. 62/168,951, filed Jun. 1, 2015, the disclosure of whichis incorporated herein by reference in its entirety.

FIELD OF THE DISCLOSURE

The present disclosure relates to providing electromagnetic shieldingfor integrated circuit modules, and more particularly to providingelectromagnetic shielding for integrated circuit modules in a waferlevel fan-out packaging process.

BACKGROUND

Electronic components have become ubiquitous in modern society. Theelectronics industry proudly, but routinely, announces acceleratedclocking and transmission speeds and smaller integrated circuit modules.While the benefits of these devices are myriad, smaller and fasterelectronic devices create problems. In particular, high operatingfrequencies inherently require fast transitions between signal levels.Fast transitions between signal levels create electromagnetic emissionsthroughout the electromagnetic spectrum. Such emissions are regulated bythe Federal Communications Commission (FCC) and other regulatoryagencies. The electromagnetic emissions radiate from a source and mayimpinge upon other electronic components. If the signal strength of theemissions at the impinged upon electronic component is high enough, theemissions may interfere with the operation of the impinged uponelectronic component. This phenomenon is sometimes calledelectromagnetic interference (EMI) or crosstalk.

One way to reduce EMI is to shield the integrated circuit modules thatcause EMI or that are sensitive to EMI. Typically the shield is formedof a grounded conductive material that covers a circuit module or aportion thereof. The shield may be formed during a packaging process.When electromagnetic emissions from electronic components within theshield strike the interior surface of the shield, the electromagneticemissions are electrically shorted through the grounded conductivematerial, thereby reducing emissions. Likewise, when emissions fromoutside the shield strike the exterior surface of the shield, a similarelectrical short occurs, and the electronic components do not experiencethe emissions.

Wafer level fan-out (WLFO) packaging technology currently attractssubstantial attention in the 3D packaging area. WLFO technology isdesigned to provide high density input/output ports (I/O) withoutincreasing the size of a semiconductor package. This capability allowsfor densely packaged small integrated circuit modules within a singlewafer. As the size of the integrated circuit module is reduced, the needfor isolation between various types of functional integrated circuitmodules in close proximity to one another increases. Unfortunately, asthe integrated circuit modules continue to become smaller fromminiaturization, creating effective shields that do not materially addto the size of the integrated circuit module adds complexity and cost tothe fabrication process.

As such, there is a need for an electromagnetic shield that isinexpensive to manufacture on a large scale, does not substantiallychange the size of the integrated circuit module, and effectively dealswith interference caused by unwanted electromagnetic emissions.

SUMMARY

The present disclosure integrates electromagnetic shielding into a waferlevel fan-out (WLFO) packaging process, where the process includesforming a shielding structure over multiple modules. According to anexemplary process, a mold wafer having multiple modules is firstprovided. Each module includes a die with an input/output (I/O) port ata bottom surface of the die. The die is adjacent to an inter-module areaand partially encapsulated by a mold compound leaving the bottom surfaceof the die exposed. Then, a first dielectric pattern is formed over abottom surface of the mold wafer exposing the I/O port for each module,and a redistribution structure that includes a shield connected elementis formed over the first dielectric pattern. The shield connectedelement is coupled to the I/O port and extends laterally from the I/Oport into the inter-module area for each module. Next, the mold wafer issub diced at the inter-module area to create a cavity for each modulethat extends into the mold wafer from a top surface of the mold waferwithout extending completely through the mold compound. A portion of theshield connected element is then exposed through the bottom of thecavity for each module and a shielding structure is formed over the topsurface of the mold wafer and exposed faces of the cavity for eachmodule. The shielding structure is in contact with the shield connectedelement. Lastly, the mold wafer is singulated to form a number ofshielded modules, where the shielding structure for each shielded moduleremains in contact with the shield connected element.

Those skilled in the art will appreciate the scope of the disclosure andrealize additional aspects thereof after reading the following detaileddescription in association with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings incorporated in and forming a part of thisspecification illustrate several aspects of the disclosure, and togetherwith the description serve to explain the principles of the disclosure.

FIGS. 1A-1D illustrate an exemplary process to provide a mold waferhaving a number of modules.

FIG. 2 provides a flow diagram that illustrates an exemplary wafer levelfan-out (WLFO) packaging process with electromagnetic shieldingaccording to one embodiment of the present disclosure.

FIGS. 3A-3L illustrate the steps associated with the WLFO packagingprocess of FIG. 1.

DETAILED DESCRIPTION

The embodiments set forth below represent the necessary information toenable those skilled in the art to practice the embodiments andillustrate the best mode of practicing the embodiments. Upon reading thefollowing description in light of the accompanying drawing figures,those skilled in the art will understand the concepts of the disclosureand will recognize applications of these concepts not particularlyaddressed herein. It should be understood that these concepts andapplications fall within the scope of the disclosure and theaccompanying claims.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

It will be understood that when an element such as a layer, region, orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present.Likewise, it will be understood that when an element such as a layer,region, or substrate is referred to as being “over” or extending “over”another element, it can be directly over or extend directly over theother element or intervening elements may also be present. In contrast,when an element is referred to as being “directly over” or extending“directly over” another element, there are no intervening elementspresent. It will also be understood that when an element is referred toas being “connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

Relative terms such as “below” or “above” or “upper” or “lower” or“horizontal” or “vertical” may be used herein to describe a relationshipof one element, layer, or region to another element, layer, or region asillustrated in the Figures. It will be understood that these terms andthose discussed above are intended to encompass different orientationsof the device in addition to the orientation depicted in the Figures.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including” when used herein specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms used herein should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthis specification and the relevant art and will not be interpreted inan idealized or overly formal sense unless expressly so defined herein.

The present disclosure relates to integrating electromagnetic shieldinginto a wafer level fan-out (WLFO) packaging process, where the processincludes forming a shielding structure over each of a number of modules.WLFO packaging processes normally use 300 mm diameter wafers with a widerange of package thickness. For the present disclosure, the WLFOpackaging process with electromagnetic shielding focuses on packagesthat are less than 400 microns (pms) thick. FIGS. 1A-1D illustrate anexemplary process to provide a mold wafer having a number of modules.FIG. 2 provides a flow diagram that illustrates an exemplary WLFOpackaging process with electromagnetic shielding according to oneembodiment of the present disclosure. FIGS. 3A-3L illustrate the stepsassociated with the WLFO packaging process of FIG. 2.

Initially, an adhesive layer 10 is applied on a top surface of a carrier12 as depicted in FIG. 1A; and a number of electronic component groups14 are attached to the adhesive layer 10 as depicted in FIG. 1B. For thepurpose of this illustration, each electronic component group 14includes a first die 16 with a thickness between 30 μms-160 μms and asecond die 18 with a thickness between 30 μms-160 μms. The first die 16has a first I/O port (not shown) at a bottom surface of the first die 16and the second die 18 has a second I/O port (not shown) at a bottomsurface of the second die 18. The first I/O port and the second I/O portare used to connect to ground. In different applications, eachelectronic component group may include fewer or more semiconductor diesand may also include other electronic components. Next, a mold compound20 is applied over the number of electronic component groups 14 to formmultiple modules 22 as depicted in FIG. 1C. The mold compound 20 may beapplied by various procedures, such as sheet molding, overmolding,compression molding, transfer molding, dam fill encapsulation, or screenprint encapsulation. The adhesive layer 10 and the carrier 12 are thenremoved to provide a mold wafer 24 with the multiple modules 22, asdepicted in FIG. 1D. Removal of the adhesive layer 10 and the carrier 12may be provided by heating the adhesive layer 10. The mold wafer 24 hasa thickness between 130 μms-350 μms. For each of the multiple modules22, the bottom surfaces of the first die 16 and the second die 18 areexposed.

With reference to FIGS. 3A through 3E, a redistribution process isprovided according to one embodiment of the present disclosure. Theprocess begins by providing the mold wafer 24, as depicted in FIG. 3A(Step 100). The mold wafer 24 includes the multiple modules 22 and eachof the multiple modules 22 includes the first die 16 with the first I/Oport (not shown) and the second die 18 with the second I/O port (notshown). The first die 16 and the second die 18 are partiallyencapsulated by the mold compound 20 leaving the bottom surfaces of thefirst die 16 and the second die 18 exposed. Each of the multiple modules22 is surrounded by a first inter-module area 26 adjacent to the firstdie 16 and a second inter-module area 28 adjacent to the second die 18.The first inter-module area 26 and the second inter-module area 28 foradjacent modules of the multiple modules 22 are formed from a commoninter-module area 26(28).

Then, a first dielectric pattern 30 is formed over a bottom surface ofthe mold wafer 24, as depicted in FIG. 3B (Step 102). The firstdielectric pattern 30 may be formed of benzocyclobutene (BCB),polyimide, or other dielectric materials. The first I/O port (not shown)at the bottom surface of the first die 16 is exposed through the firstdielectric pattern 30 at a location 32 for each module. The second I/Oport (not shown) at the bottom surface of the second die 18 is exposedthrough the first dielectric pattern 30 at a location 34 for eachmodule. In different applications, there may be other I/O ports (notshown) at the bottom surfaces of the first die 16 and the second die 18exposed through the first dielectric pattern 30 at locations 36.

The next process step is to form a redistribution structure 38 over thefirst dielectric pattern 30, as depicted in FIG. 3C (Step 104). Theredistribution structure 38 may be formed of copper or other suitableconductive material. As illustrated, the redistribution structure 38includes multiple conductive elements. These conductive elementsgenerally connect with the various I/O ports (not shown) at the bottomsurfaces of the first die 16 and the second die 18. The redistributionstructure 24 includes a first shield connected element 40 that iscoupled to the first I/O port (not shown) at the location 32 and extendslaterally from the first I/O port (not shown) into the firstinter-module area 26 for each of the multiple modules 22. Theredistribution structure 24 also includes a second shield connectedelement 42 that is coupled to the second I/O port (not shown) at thelocation 34 and extends laterally from the second I/O port (not shown)into the second inter-module area 28 for each of the multiple modules22. Further, the redistribution structure 24 includes non-shieldconnected elements 44 that are coupled to other I/O ports (not shown) atthe locations 36 at the bottom surfaces of the first die 16 and thesecond die 18. The non-shield connected elements 44 do not extend toeither the first inter-module area 26 or the second inter-module area28. Notice that the first shield connected element 40 and the secondshield connected element 42 of the adjacent modules of the multiplemodules 22 may be formed from a common section of the redistributionstructure 38 (i.e. the central section in FIG. 3C).

Next, a second dielectric pattern 46 is formed over the redistributionstructure 38 as depicted in FIG. 3D (Step 106). The second dielectricpattern 46 may be formed of benzocyclobutene (BCB), polyimide or otherdielectric materials. Herein a bottom portion of the first shieldconnected element 40, a bottom portion of the second shield connectedelement 42, and a bottom portion of each of the non-shield connectedelements 44 are exposed through the second dielectric pattern 46. Atotal thickness of the first dielectric pattern 30, the redistributionstructure 38, and the second dielectric pattern 46 is approximately 30μms-40 μms. Bump contacts 48 are then applied to the exposed bottomportions of the first shield connected element 40, the second shieldconnected element 42, and the non-shield connected elements 44, asdepicted in FIG. 3E (Step 108). The bump contacts 48 may be applied by astandard bumping procedure or a land grid arrays process.

With reference to FIGS. 3F through 3L, a process for shielding each ofthe multiple modules 22 is provided according to one embodiment of thepresent disclosure. After a laser mark process (Step 110), a ring tape50 with strong chemical resistance is applied over the second dielectricpattern 46 to encapsulate the bump contacts 48 as depicted in FIG. 3F(Step 112). The main purpose of the ring tape 50 is to provide a wafersupport to the mold wafer 24 during the following sub-dicing process.Herein, the ring tape 50 includes two layers: an adhesive layer (notshown) in contact with the second dielectric pattern 46 and a backerlayer (not shown) that may be formed of polyolefin materials. The ringtape 50 has a thickness between 80 μms-180 μms.

Next, the mold wafer 24 is sub-diced at each inter-module area 26/28 tocreate an elongated cavity 52 that may substantially or completelysurround each of the multiple modules 22, as depicted in FIG. 3G (Step114). The elongated cavity 52 extends into the mold wafer 24 from a topsurface of the mold wafer 24, without extending completely through themold compound 20. In one embodiment, sub-dicing the mold wafer 24 ateach inter-module area 26/28 refers to forming the elongated cavity 52such that the elongated cavity 52 extends between 60%-97%, and perhapsbetween 75%-95%, into the mold compound 20. Normally, at the bottom ofthe elongated cavity 52, there remains a thin layer of the mold compound20 over the redistribution structure 38. More specifically, at thebottom of the elongated cavity 52, there remains a thin layer of themold compound 20 over the first shield connected element 40 for one ofthe multiple modules 22 and over the second shield connected element 42for an adjacent module of the multiple modules 22. In addition, the moldcompound 20 is also left on the sidewalls of the elongated cavity 52.The first die 16 and the second die 18 are exposed in the elongatedcavity 52.

After the sub-dicing procedure is completed, a portion of the firstshield connected element 40 and a portion of the second shield connectedelement 42 are exposed through the bottom of the elongated cavity 52, asdepicted in FIG. 3H (Step 116). In detail, a first portion of the moldcompound 20 and a first portion of the first dielectric pattern 30 atthe bottom of the elongated cavity 52 are removed to form a channel 54that exposes a portion of the first shield connected element 40. Asecond portion of the mold compound 20 and a second portion of the firstdielectric pattern 30 at the bottom of the elongated cavity 52 areremoved to form a channel 56 that exposes a portion of the second shieldconnected element 42. The channels 54 and 56 may be formed on oppositesides of the elongated cavity 52 and adjacent to the side walls of theelongated cavity 52 such that a mesa 58 may remain between the channels54 and 56 in the elongated cavity 52. Herein, the channels 54 and 56within the same elongated cavity 52 are formed for the adjacent modulesof the multiple modules 22. A portion of the first shield connectedelement 40 and a portion of the second shield connected element 42 maybe removed during the exposing process. In one embodiment, the firstshield connected element 40 and the second shield connected element 42may be exposed using laser drilling. In the illustrated embodiment, thechannels 54 and 56 are drilled into the elongated cavity 52 to expose aportion of the first shield connected element 40 and a portion of thesecond shield connected element 42, respectively. The channels 54 and 56may extend through the first dielectric pattern 30 and either to or intothe first shield connected element 40 and the second shield connectedelement 42, respectively. The elongated cavity 52, the channels 54 and56, and the mesa 58 may substantially or completely surround each of themultiple modules 22, such that nearly all of the vertical sides and topsurfaces of each of the multiple modules 22 will be effectively shieldedin a later shielding process.

In order to provide additional protection from a subsequent shieldingprocess, which will be described further below, a protective layer 60may be applied over a bottom surface of the ring tape 50, as depicted inFIG. 3I (Step 118).

Next, a shield process is used to create a shielding structure 62 overthe top surface of the mold wafer 24, any exposed faces of the elongatedcavity 52, and channels 54 and 56, as depicted in FIG. 3J (Step 120). Assuch, the shielding structure 62 is in direct contact with the firstshield connected element 40 and the second shield connected element 42for each of the multiple modules 22. The shielding structure 62 includesat least a first layer 64 and a second layer 66. In one embodiment, thefirst layer 64 may be formed of nickel with a thickness of 1 μm-3 μmsusing an electrolytic plating process. The second layer 66 may be formedof copper with a thickness of 3 μms-16 μms using an electroless and/orelectrolytic plating process.

The shielded mold wafer 24 is then singulated at each inter-module area26/28 to form multiple shielded modules 22S, as depicted in FIG. 3K(Step 122). All or a substantial portion of each inter-module area 26/28may be destroyed when the multiple modules 22S are separated from oneanother. Care should be taken to ensure that the shielding structure 62of each of the multiple shielded modules 22S remains in direct contactwith the first shield connected element 40 and the second shieldconnected element 42. Lastly, as depicted in FIG. 3L (Step 124), theprotective layer 60 and the ring tape 50 are removed from each of themultiple shielded modules 22S.

Those skilled in the art will recognize improvements and modificationsto the embodiments of the present disclosure. All such improvements andmodifications are considered within the scope of the concepts disclosedherein and the claims that follow.

What is claimed is:
 1. A method comprising: providing a mold waferhaving a plurality of modules, wherein each of the plurality of modulescomprises a die with an input/output (I/O) port at a bottom surface ofthe die, wherein the die is adjacent to an inter-module area andpartially encapsulated by a mold compound leaving the bottom surface ofthe die exposed; forming a first dielectric pattern over a bottomsurface of the mold wafer, wherein the I/O port is exposed through thefirst dielectric pattern for each of the plurality of modules; forming aredistribution structure over the first dielectric pattern, wherein theredistribution structure comprises a shield connected element that iscoupled to the I/O port and extends laterally from the I/O port into theinter-module area for each of the plurality of modules; forming a seconddielectric pattern over the redistribution structure, wherein a bottomportion of the shield connected element is exposed through the seconddielectric pattern for each of the plurality of modules; applying a bumpcontact to the exposed bottom portion of the shield connected elementfor each of the plurality of modules; sub-dicing the mold wafer at theinter-module area to create a cavity for each of the plurality ofmodules, wherein the cavity extends into the mold wafer from a topsurface of the mold wafer without extending completely through the moldcompound; removing a portion of the mold compound and a portion of thefirst dielectric pattern at a bottom of each cavity to form a channelthat exposes a portion of the shield connected element for each of theplurality of modules; forming a shielding structure over the top surfaceof the mold wafer and exposed faces of the cavity for each of theplurality of modules, wherein the shielding structure is in contact withthe shield connected element; and singulating the mold wafer at theinter-module area for each of the plurality of modules to form aplurality of shielded modules, wherein the shielding structure for eachof the plurality of shielded modules remains in contact with the shieldconnected element.
 2. The method of claim 1 wherein removing the portionof the mold compound and the portion of the first dielectric pattern atthe bottom of each cavity to form the channel is provided by laserdrilling.
 3. The method of claim 1 wherein providing the mold waferhaving the plurality of modules comprises: applying an adhesive layer ona top surface of a carrier; attaching a plurality of electroniccomponent groups to the adhesive layer, wherein each of the plurality ofelectronic component groups comprises the die with the I/O port at thebottom surface of the die; applying the mold compound over the pluralityof electronic component groups to form the plurality of modules; andremoving the carrier and the adhesive layer to form the mold wafer,wherein the I/O port is exposed.
 4. The method of claim 1 wherein theredistribution structure comprises copper.
 5. The method of claim 1wherein the first dielectric pattern is formed of benzocyclobutene (BCB)or polyimide.
 6. The method of claim 1 wherein the shielding structurecomprises: a first layer comprising nickel; and a second layercomprising copper.
 7. The method of claim 6 wherein a thickness of thefirst layer is between 1 μm and 3 μms.
 8. The method of claim 6 whereina thickness of the second layer is between 3 μms and 16 μms.
 9. Themethod of claim 1 wherein a total thickness of the first dielectricpattern, the redistribution structure, and the second dielectric patternis between 30 μms and 40 μms.
 10. The method of claim 1 wherein thesecond dielectric pattern is formed of benzocyclobutene (BCB) orpolyimide.
 11. The method of claim 1 further comprising, beforesub-dicing the mold wafer, applying a ring tape over the seconddielectric pattern.
 12. The method of claim 11 wherein the ring tapecomprises: an adhesive layer in contact with the second dielectricpattern; and a backer layer that is formed of polyolefin materials. 13.The method of claim 1 wherein the mold wafer has a thickness between 130μms and 350 μms.
 14. A method comprising: providing a mold wafer havinga plurality of modules, wherein each of the plurality of modulescomprises a first die with a first input/output (I/O) port at a bottomsurface of the first die and a second die with a second I/O port at abottom surface of the second die, wherein the first die and the seconddie are partially encapsulated by a mold compound leaving the bottomsurfaces of the first die and the second die exposed, wherein each ofthe plurality of modules is surrounded by a first inter-module areaadjacent to the first die and a second inter-module area adjacent to thesecond die, wherein the first inter-module area and the secondinter-module area for adjacent modules of the plurality of modules areformed from a common inter-module area; forming a first dielectricpattern over a bottom surface of the mold wafer, wherein the first I/Oport and the second I/O port are exposed through the first dielectricpattern for each of the plurality of modules; forming a redistributionstructure over the first dielectric pattern, wherein the redistributionstructure comprises a first shield connected element and a second shieldconnected element, wherein the first shield connected element is coupledto the first I/O port and extends laterally from the first I/O port intothe first inter-module area, and the second shield connected element iscoupled to the second I/O port and extends laterally from the second I/Oport into the second inter-module area; sub-dicing the mold wafer at thecommon inter-module area to create a cavity for the adjacent modules ofthe plurality of modules, wherein the cavity extends into the mold waferfrom a top surface of the mold wafer without extending completelythrough the mold compound; removing a first portion of the mold compoundand a first portion of the first dielectric pattern at a bottom of thecavity to form a first channel that exposes a portion of the firstshield connected element, and removing a second portion of the moldcompound and a second portion of the first dielectric pattern at thebottom of the cavity to form a second channel that exposes a portion ofthe second shield connected element for the adjacent modules of theplurality of modules; and forming a shielding structure over the topsurface of the mold wafer and exposed faces of the cavity for theadjacent modules of the plurality of modules, wherein the shieldingstructure is in contact with the first shield connected element and thesecond shield connected element.
 15. The method of claim 14 wherein thefirst shield connected element and the second shield connected elementof the adjacent modules of the plurality of modules are formed from acommon section of the redistribution structure.
 16. The method of claim14 wherein the first channel and the second channel are formed onopposite sides of the cavity and adjacent side walls of the cavity suchthat a mesa remains between the first channel and the second channel.17. The method of claim 14 wherein removing the first portion of themold compound and the first portion of the first dielectric pattern atthe bottom of the cavity to form the first channel and removing thesecond portion of the mold compound and the second portion of the firstdielectric pattern at the bottom of the cavity to form the secondchannel are provided by laser drilling.